发明名称 NOBLE METAL SURFACE ACTIVATION LIQUID FOR ELECTROLESS NICKEL PLATING
摘要 PROBLEM TO BE SOLVED: To provide a pre-treatment liquid to a noble metal capable of depositing an excellent electroless nickel coating film only on a noble metal portion by a simple treatment method when depositing the electroless nickel coating film on a noble metal such as gold. SOLUTION: A noble metal surface activation liquid for the electroless nickel plating is composed of of aqueous solution containing (i) a complexing agent, (ii) at least one component selected from a group composed of copper salt and silver salt, and (iii) aldehydes. In the electroless nickel plating method on the noble metal, the surface of the noble metal is activated by using the activation liquid, a catalyst for the electroless plating is provided, and then, the electroless nickel plating is performed. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007177268(A) 申请公布日期 2007.07.12
申请号 JP20050375249 申请日期 2005.12.27
申请人 OKUNO CHEM IND CO LTD 发明人 SHIMOJI TERUAKI;MURATA TOSHIYA
分类号 C23C18/18;C23C18/32;H01L21/28;H01L21/288;H05K3/18 主分类号 C23C18/18
代理机构 代理人
主权项
地址