| 摘要 |
PROBLEM TO BE SOLVED: To provide an abrasive which bores a deeper hole by reducing heat of a core bit caused by boring, and keeps a boring speed when boring the deeper hole in a dry processing, and also to provide a boring process using the same. SOLUTION: An abrasive grain that files a diamond chip 31 is additionally provided with superfine silica and a hydrous resin that are supplied between the tip of the core bit 11 configured by bonding the diamond chip 31 to the tip of a cylindrical shank that is rotation-driven around its axis, and a bored material 20 against which the tip of the core bit is pressed to get bore, and is used as an abrasive 51 that files the diamond chip 31. COPYRIGHT: (C)2007,JPO&INPIT
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