发明名称 |
Integrated capacitors in package-level structures, processes of making same, and systems containing same |
摘要 |
An article includes a top electrode that is embedded in a solder mask. An article includes a top electrode that is on a core structure. A process of forming the top electrode includes reducing the solder mask thickness and forming the top electrode on the reduced-thickness solder mask. A process of forming the top electrode includes forming the top electrode over a high-K dielectric that is in a patterned portion of the core structure.
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申请公布号 |
US2007158818(A1) |
申请公布日期 |
2007.07.12 |
申请号 |
US20050323312 |
申请日期 |
2005.12.30 |
申请人 |
TANG JOHN J;ZENG XIANG Y;HE JIANGQI;HAI DING |
发明人 |
TANG JOHN J.;ZENG XIANG Y.;HE JIANGQI;HAI DING |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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