| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily specify a wire-bonding apparatus to be used for a wire-bonding process of a semiconductor device, which is such that semiconductor chips are mounted in a narrow pitch on a multilayer wiring board and are sealed. <P>SOLUTION: First, the multilayer wiring board is prepared, and then the semiconductor chips are die-bonded on the multilayer wiring board (process S1). Next, electrode pads (first electrodes) on the semiconductor chips and a metal interconnection (second electrode) on the multilayer wiring board are wire-bonded (process S4) by the wire-bonding apparatus. In the wire-bonding process, wire-bonding information is marked by laser on the wire-bonded multilayer wiring board by a laser marker mechanism of the wire-bonding apparatus. Then, a sealing body, formed of a resin, is formed on the multilayer wiring board so as to cover the semiconductor chips (process S5). <P>COPYRIGHT: (C)2007,JPO&INPIT |
