| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip mounting substrate, capable of improving mounting reliability by reducing the thermal expansion coefficient between the substrate and a semiconductor chip, and to provide a manufacturing method therefor. SOLUTION: A core substrate 2 of a packaged board 10 is made of a titanium alloy having a small thermal expansion coefficient. Anode oxidation films 3 are formed on the front and rear surfaces. A plurality of through-holes 4, piercing the front and rear surfaces of the core substrate 2, are provided on the core substrate 2, and an anode oxidation films 3 is also formed on the internal wall surfaces of the through-holes. Wiring layers, having a plurality of conductor patterns 6 electrically connected with each other via the through-holes 4, are formed on the anode oxidation films 3 on the front and the rear surfaces of the core substrate 2. COPYRIGHT: (C)2007,JPO&INPIT
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