| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate inspection device capable of more efficiently performing four-terminal measurement for a high-density wiring pattern. SOLUTION: In the substrate inspection device composed of first and second probes each brought into contact with an inspection point of the wiring of the substrate to be inspected, wherein one is used as the probe for voltage measurement and the other is used as the probe for current supply, and the resistance value of the wiring is calculated using a plurality of inspection probes with the first and second probes brought into contact with the inspection points; the substrate inspection device includes: a current supply means for supplying a current to the probe for current supply; a voltage measurement means for measuring the voltage between the probes for voltage measurement; a processing means for calculating the resistance value of the wiring by a current value supplied by the current supply means and a voltage value measured by the voltage measurement means; and an integrally formed conductive connection member conductively connecting the plurality of probes for current supply with the current supply means and electrically interconnecting the plurality of probes for current supply. COPYRIGHT: (C)2007,JPO&INPIT
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