发明名称 METHOD OF FABRICATING A TRENCH ISOLATION LAYER IN A SEMICONDUCTOR DEVICE
摘要 A method of fabricating a trench isolation layer in a semiconductor device. A method of fabricating a trench isolation layer in a semiconductor device, which may remove particles (e.g. in the form of an oxide layer) that are formed during a moat wet etch process.
申请公布号 US2007161253(A1) 申请公布日期 2007.07.12
申请号 US20060617383 申请日期 2006.12.28
申请人 JANG SEUNG S;CHOI YONG K 发明人 JANG SEUNG S.;CHOI YONG K.
分类号 H01L21/311;C23F1/00;H01L21/302;H01L21/306;H01L21/461 主分类号 H01L21/311
代理机构 代理人
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