| 摘要 |
A method for depositing a material layer on a substrate surface, wherein the substrate is introduced into a process chamber, wherein the material layer is applied by at least one movable plasma source, wherein the position and the angular position of the plasma source with respect to the substrate are controlled by a control, wherein, for the purpose of coating a substrate with a three-dimensional surface, the control receives measurement data from a measuring arrangement, which measures a curve of the three-dimensional substrate surface at the location to be deposited, wherein, depending on those measurement data, the control controls the position of the plasma source with respect to the deposition location so that the material to be deposited is applied to the respective location in a desired manner. The invention further relates to an apparatus for applying a material layer to a substrate surface utilizing the above-described method and to a substrate, provided with a surface with at least one layer of material deposited thereon, wherein the layer has been deposited utilizing the above-described method and/or has been manufactured with the aid of an above-described apparatus. |
