| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor device with high efficiency and high reliability, and to provide a manufacturing method of the device. <P>SOLUTION: When a lead frame 12 is mounted on a semiconductor element 1, a plating film 4 by Ag or Ag alloy is given to a region where the semiconductor element 1 and the lead frame are jointed. A conductive adhesive 11 comprising nanoparticles is used as a bonding material in mounting. Heat generated from the optical semiconductor element is efficiently discharged outside a package, and a structure, where performance for discharging light is easily maintained can be constituted and reliability over long time, can be secured. <P>COPYRIGHT: (C)2007,JPO&INPIT |
