| 摘要 |
PROBLEM TO BE SOLVED: To surely prevent the occurrence of shortage resulting from the adhesion of soldering balls for forming a terminal for connection in a semiconductor device such as a CSP. SOLUTION: First, a silicon substrate 11 in which a columnar electrode 18, a resist pattern 21, and the like are formed is fixed in a container 24. Then, electrically conductive solution 25 comprising a soldering ball 23 is housed in the container 24. Then, the top surface of the container 24 is sealed with a lid 26. Then, the whole container 24 is vertically and obliquely oscillated as shown by an arrow. The soldering ball 23 in the electrically conductive solution 25 is flown into each opening portion 22 of the resist pattern 21 one by one. In this case, since the soldering ball 23 is incorporated in the electrically conductive solution 25, the soldering ball 23 does not have static electricity in the electrically conductive solution 25. Therefore, the soldering balls 23 can be made not to be adhered to each other in the electrically conductive solution 25. Additionally, the surface of the resist pattern 21 may be coated with the electrically conductive solution 25 using a nozzle. COPYRIGHT: (C)2007,JPO&INPIT
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