发明名称 SUBSTRATE RESIN LAMINATED STRUCTURE AND OPTICAL WAVEGUIDE MODULE
摘要 PROBLEM TO BE SOLVED: To improve the joining strength between a resin layer and a substrate by using an intermediate layer of a new structure in a substrate resin laminated structure in which the resin layer is laminated on the surface of the substrate such as a Si substrate. SOLUTION: A surface-modified film 15 (SiO<SB>2</SB>heat-oxidized film) is formed on the surface of the Si substrate 12 by heat oxidation etc. At least one oxidized film 16 (SiOx film) is formed on the surface-modified film 15 by a spatter or CVD, and the resin layer is formed on the oxidized film 16. The density of the oxidized film 16 is greater than that of the surface-modified film 15. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007175891(A) 申请公布日期 2007.07.12
申请号 JP20050373928 申请日期 2005.12.27
申请人 OMRON CORP 发明人 TANIGUCHI HISASHI;OMURA HIDEKAZU
分类号 B32B27/00;B32B9/00;B32B15/082;G02B6/12;G02B6/122;G02B6/30 主分类号 B32B27/00
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