| 摘要 |
A method of fabricating a sub-feature size pillar structure on an integrated circuit. The process first provides a substrate having formed thereon a phase change layer, an electrode layer and a hard-mask layer. Then there is formed a feature-size hard-mask, by lithographically patterning, etching and stripping a photoresist layer, followed by trimming the hard-mask to a selected sub-feature size, wherein the trimming step is highly selective between the electrode and phase change material layers and the hard-mask. The final steps are trimming the electrode and phase change layers to the size of the hard-mask and removing the hard-mask.
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