发明名称 METHOD AND APPARATUS FOR THERMAL MANAGEMENT OF COMPUTER MEMORY MODULES
摘要 A heat spreader and method for thermal management of a computer memory module by promoting natural convection cooling of the memory module. The heat spreader includes a frame surrounding a planar body adapted to be mounted to a memory module of a computer, and a grid defined in the planar body by a plurality of uniformly distributed perforations. The perforations extend through the planar body to allow natural convention between an interior space beneath the planar body and an exterior space above the planar body.
申请公布号 US2007159789(A1) 申请公布日期 2007.07.12
申请号 US20070621396 申请日期 2007.01.09
申请人 OCZ TECHNOLOGY GROUP, INC. 发明人 SCHUETTE FRANZ M.;PETERSEN RYAN M.;NELSON ERIC L.;SETHI BHULINDER
分类号 G06F1/20 主分类号 G06F1/20
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