发明名称 |
Multilayer substrate with built-in-chip-type electronic component and method for manufacturing the same |
摘要 |
A multilayer substrate having a built-in chip-type electronic component includes a ceramic laminate having a plurality of ceramic layers, a chip-type electronic component disposed in the ceramic laminate and having an external terminal electrode, and a via conductor disposed in the ceramic layers in the lamination direction. The external terminal electrode of the chip-type electronic component is connected to the via conductor, and a connection step is provided in at least one of the upper and lower end surfaces of the via conductor.
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申请公布号 |
US2007158101(A1) |
申请公布日期 |
2007.07.12 |
申请号 |
US20050597919 |
申请日期 |
2005.10.20 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
CHIKAGAWA OSAMU;SAKAI NORIO |
分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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