There is provided a method of forming a component package. The method includes the steps of providing the die pad or heat sink, forming an isolation layer on the rear surface of the die pad or heat sink and encapsulating the die pad with encapsulating material in a mould cavity after forming the isolation layer on the rear of the die pad or heat sink.
申请公布号
WO2007046771(A8)
申请公布日期
2007.07.12
申请号
WO2005SG00362
申请日期
2005.10.19
申请人
INFINEON TECHNOLOGIES AG;TONG, SOON, HOCK;YONG, WAE, CHET;JOB DORAISAMY, STANLEY
发明人
TONG, SOON, HOCK;YONG, WAE, CHET;JOB DORAISAMY, STANLEY