| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for reading a discrimination mark capable of reading a discrimination mark even if a main surface side of a wafer where the discrimination mark is formed is sealed with resin. SOLUTION: A reading device A for a discrimination mark 20 comprises an illumination unit 13 equipped with a light source 10 for emitting infrared beam, and an imaging unit 16 which receives the reflection light of infrared beam for imaging emitted from the illumination unit 13 toward a wafer 1. The infrared beam is so emitted as the optical axis crosses a main surface 1c of the wafer 1 from a rear surface 1b side of the wafer 1. The reflection light of the infrared beam is received and imaged, that has transmitted the wafer 1 and is reflected on the main surface 1c side to read the discrimination mark 20 formed on the main surface 1c side of the wafer 1. COPYRIGHT: (C)2007,JPO&INPIT |
