| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device capable of allowing a heat radiator to continuously contact all over the surface of a cooling object with a pressing force as small as possible. SOLUTION: A thermally conductive fluid 23 is sandwiched between an electronic component 19 and a heat sink 14. The fluid 23 improves the adhesiveness between the electronic component 19 and the heat sink 14, and exhibits a predetermined adsorbing force based on its flowing performance. The adsorbing force restricts displacement of the heat sink 14 in a vertical direction orthogonal to the surface of the electronic component 19, while allowing sideslip of the heat sink 14 on the surface of the electronic component 19. The heat sink 14 can be held on the electronic component 19 with the atmospheric pressure. Since the sideslip of the heat sink 14 is restricted, the thermally conductive fluid 23 can be ensured with sufficient spread between the heat sink 14 and the electronic component 19, irrespective of the inclination and vibration of the electronic component 19. The thermally conductive fluid 23 continues to exhibit the sufficient adsorbing force. COPYRIGHT: (C)2007,JPO&INPIT
|
