| 摘要 |
PROBLEM TO BE SOLVED: To provide a small and highly reliable semiconductor imaging device capable of downsizing and miniaturizing the device with the use of the common structure of the signal voltage reading part with four photoelectric converting parts adjacent in columns, and suppressing a vaiation in signal voltage to elaborately reading the signal by arranging each photoelectric converting part as equally spaced as possible. SOLUTION: The semiconductor imaging device comprises the four PDs (PD1 to PD4) aligning in a row direction that have the signal voltage reading part in common. Each component, PD1/FD1, TG-Tr1,2/PD2/SF-Tr, SL-Tr/PD3/FD2, TG-Tr3,4/PD4/RS-Tr is arranged in this order. COPYRIGHT: (C)2007,JPO&INPIT
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