VERFAHREN UND VORRICHTUNG ZUM ÜBERPRÜFEN VON ELEKTRISCHEN BAUTEILEN IN EINER BESTÜCKVORRICHTUNG FÜR SUBSTRATE

摘要

A method and device are for monitoring electric components in a pick-and-place device for substrates. The underside of a pick-up is monitored by an optical scanner during the pick-up phase and during the placing phase of a component. A lift drive for the pick-up is provided with a position sensor that is linked with a control device. The scanner emits and receives a scanning beam oriented transversally to the direction of lift and is likewise coupled with the control device, thereby allowing monitoring of the underside of the pick-up in a direct time-related manner with the picking and placing of the component. The various lift positions are saved and compared when a threshold value of the received scanning beam is exceeded so that the inventive device also allows for a monitoring of the height of the component.