| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device wherein the surface shape of the device is not deformed by a solder mounting part by completely housing the solder mounting part in the inside of the device, and the solder mounting part can be mounted to a prescribed area by restricting the area. SOLUTION: This high frequency device is equipped with a member 62 to be soldered, first members 81A, 81B in which a first passage 87A for incorporating the member 62 to be soldered is provided, a second member in which a second passage for incorporating the member 62 to be soldered is provided. The second member is formed of a member having better solder wettability than the first members 81A, 81B, and the member 62 to be soldered which are incorporated along the first passage 87A of the first members 81A, 81B and the second passage of the second member is fixed by solder in the second passage of the second member. COPYRIGHT: (C)2007,JPO&INPIT
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