| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a continuous wiring board provided at its both surfaces with defective display that may be formed easily to the wiring board determined as a defective substrate. <P>SOLUTION: The continuous wiring substrate is formed by continuously arranging, via cutting intervals, a plurality of wiring substrates having one surface for sealing a semiconductor chip with insulating resin and the other surface for mounting to a mounting substrate. A wiring substrate determined as a defective substrate among multiple wiring substrates includes through-holes provided to extend from one surface to the other surface for verifying that the wiring substrate is determined as the defective substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
