| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that has no contamination on its surface by eliminating dust deposited on the surface of each dicing line and on the surface of each chip including an electrode pad while transferring the dust onto an adhesive, and to provide its manufacturing method. SOLUTION: The manufacturing method is composed so as to prevent the surface from being contaminated by eliminating the dust deposited on the surface of each chip while transferring it onto the adhesive by sticking the adhesive of a surface protection tape again onto the surface of each chip, where the surface protection tape is peeled off during grinding by executing either of heating and pressurization, or by simultaneously executing both of them to the surface protection tape after the end of a grinding step (S3). COPYRIGHT: (C)2007,JPO&INPIT |
