| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device for an electronic component that can improve endothermic performance for heat generated from a high heat radiating electronic component. SOLUTION: An indraft nozzle is perpendicularly arranged to a plate-shaped heat-drawing fin 4a of an endothermic body which is brought into contact with a heating element 2 to be cooled off, wherein part of the plate-shaped fin 4a is shaped to be an approximate V character or an approximate U character. Further, the cooling device can be structured to have an enhanced endothermic performance by selecting an appropriate dimensional ratio between the thickness of a heat receiving plate in contact with the heating element 2 and the length of the heating element, thus making it possible to efficiently cool off a high heat radiating electronic component. COPYRIGHT: (C)2007,JPO&INPIT |
