发明名称 |
Method of attaching a high power surface mount transistor to a printed circuit board |
摘要 |
A power device that includes a printed circuit board having one or more dielectric and copper layers between a top and a bottom metal layer. The power device includes an area extending through all metal and dielectric layers of the printed circuit board except the bottom metal layer. A semiconductor device is positioned within the area and mounted to the bottom metal layer of the printed circuit board.
|
申请公布号 |
US2007158102(A1) |
申请公布日期 |
2007.07.12 |
申请号 |
US20060330774 |
申请日期 |
2006.01.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
MONROE ROBERT W. |
分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|