| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board, having high heat conducting efficiency which makes a semiconductor chip operate stably. SOLUTION: In the circuit board, a heat conducting insulation layer 17, containing a diamond powder or diamonds and diamond-like carbon films, covers mainly a substrate 10, and also, circuits 12 are disposed on the heat conducting insulating layer 17. Furthermore, mask layers 13 for solders cover portions of one of the circuits 12, and moreover, an externally exposed portion of the circuit 12 is utilized for the installation of a semiconductor chip 20. Furthermore, the heat conducting insulating layer 17 so conducts rapidly the high-temperature heat of the semiconductor chip 20 to the substrate 10 via the circuit 12 so as to maintain the normal operating temperature of the semiconductor chip 20. The heat conducting insulating layer 17 can replace an epoxied insulating layer disposed on a presently possessed circuit-plate substrate. After conducting the high-temperature heat that is generated from the high-efficiency semiconductor chip via a solder 14 and the circuit 12, the heat conducting insulating layer 17 so conducts the heat rapidly to the substrate 10 as to radiate the heat, or radiates the heat to air, by the heat exchange performed between the heat conducting insulating layer 17 and the air. COPYRIGHT: (C)2007,JPO&INPIT
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