| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling medium whereby a cooling performance can be improved by leaps and bounds, a cooling apparatus using the cooling medium, and an electronic appliance using the cooling apparatus. SOLUTION: The cooling apparatus has the constitution wherein there are connected in the form of a ring via pipings 5 with each other a heat receiving plate 1 for receiving the heat generated from an electronic component 21, a heat radiating plate 2 for radiating a heat to the external by attached heat radiating fins 7, a tank 3, and a pump 4; and a cooling medium 6 is circulated in the pipings 5 by the driving of the pump 4. The cooling medium 6 is a fluidic mixture (a) comprising such a liquid 11 as a water to be a base liquid and carbon fibers 12, or the cooling medium 6 is a fluidic mixture (b) comprising such a liquid 11 as a water to be a base liquid, and powder particles 13 made of a metal or a ceramic. The cooling medium 6 has a high heat conductivity and exhibits an excellent cooling performance since it contains the carbon fibers 12 or powder particles 13 of a high heat conductivity. COPYRIGHT: (C)2007,JPO&INPIT
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