| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface-mounting type electronic component that can be sucked and held satisfactorily by a suction nozzle for sucking by suction force, even if the surface-mounting type electronic component is particularly compact and light, and to provide a method of manufacturing the surface-mounting type electronic component. SOLUTION: A coil chip part 2 comprises a core section 4, having a pair of rectangular flanges at both the axial ends of a core-winding section 4a; a wire 10a wound around the core-winding section 4a; a flange-covering section 30a for covering break sections 10b, 10c in the wire positioned at the outer periphery of the flange halfway; a packaging resin section 30, that is formed integrally with the flange covering section 30a, covers the periphery of the wire 10a wound around the core-winding section 4a, and has a flat surface 30b at least on one surface; and a pair of edge electrodes 40, formed to directly cover the outer-periphery surface of the flange from the end face of the flanges 4b, 4c to make connection to the wire break sections 10b, 10c and to cover the flange covering section 30a in the packaging resin section 30. COPYRIGHT: (C)2007,JPO&INPIT
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