| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal-ceramics circuit board formed by joining a metal plate composed of aluminium or an aluminium alloy to a ceramics substrate, capable of preventing the blister of plating, and capable of improving the adhesiveness of the plating; and to provide a method for manufacturing the metal-ceramics circuit board. SOLUTION: The surface of the metal plate joined to the ceramics substrate and composed of aluminium or the aluminium alloy is polished by belt polishing and processed by wet blast processing for emitting a jet of abrasive slurry containing particulates in a liquid to the surface of the metal plate, and then the surface of the metal plate is plated. COPYRIGHT: (C)2007,JPO&INPIT
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