| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting structure that allows each terminal of an electronic component to be nearly uniformly bump-connected. SOLUTION: A multilayered substrate 10 is provided with laminated insulating layers 11-14 and conductor patterns respectively arranged in each of insulating layers 11-14. At least one electronic component 50 is mounted onto the multilayered substrate 10 via bumps 54, 55 by flip chip bonding. When viewed transparently in a laminating direction of the insulating layers 11-14, all through-holes 11a, 11b formed in the first insulating layer 11 of the insulating films 11-14 closest to the bumps 54, 55 in the multilayered substrate 10 are apart from all the bumps 54, 55 for mounting the electronic component 50. COPYRIGHT: (C)2007,JPO&INPIT
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