| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor element which can reduce time and cost. SOLUTION: For the method of manufacturing the semiconductor element, more specifically, a technique is disclosed in which a reflection preventing film containing silicon is formed, and then, coating of a hard mask layer and an etching processes are executed only once by performing an O<SB>2</SB>plasma process to simplify processes, thereby reducing time and cost. COPYRIGHT: (C)2007,JPO&INPIT
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