| 摘要 |
PROBLEM TO BE SOLVED: To improve the uniformity of the temperature of a wafer chuck in the prober for providing a low setting temperature by using a cooling mechanism and a heater together. SOLUTION: The prober having the wafer chuck 11 for holding the wafer W, and a control unit 16 comprises: cooling means 12, 14, 15 for cooling the surface of the chuck 11; a first heating means 19A for heating the periphery of the surface of the chuck 11; and a second heating means 13B for heating the center of the surface of the chuck 11. COPYRIGHT: (C)2007,JPO&INPIT
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