摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition which is capable of being used for manufacturing a printed wiring board excellent in flame retardant, heat resistant, moisture-resistant, and insulating properties; and capable of displaying high reliability. SOLUTION: The adhesive composition used for manufacturing the printed wiring board contains at least one kind of epoxy resin (A), a hardening agent (B) used for epoxy resin (A), a hardening accelerator (C), synthetic rubber (D), and metallic hydrate (E) as indispensable components. A metallic hydrate is processed by a glass matrix forming liquid precursor so as to obtain the metallic hydrate (E). COPYRIGHT: (C)2007,JPO&INPIT
|