发明名称 ADHESIVE COMPOSITION FOR PRINTED WIRING BOARD, FLEXIBLE COPPER-PLATED LAMINATE, ADHESIVE FILM, COVER LAY, AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide an adhesive composition which is capable of being used for manufacturing a printed wiring board excellent in flame retardant, heat resistant, moisture-resistant, and insulating properties; and capable of displaying high reliability. SOLUTION: The adhesive composition used for manufacturing the printed wiring board contains at least one kind of epoxy resin (A), a hardening agent (B) used for epoxy resin (A), a hardening accelerator (C), synthetic rubber (D), and metallic hydrate (E) as indispensable components. A metallic hydrate is processed by a glass matrix forming liquid precursor so as to obtain the metallic hydrate (E). COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007180262(A) 申请公布日期 2007.07.12
申请号 JP20050376952 申请日期 2005.12.28
申请人 KYOCERA CHEMICAL CORP 发明人 NAKAMI HIROAKI;INMAKI NORIKO;YOSHIZUMI AKIRA;UCHIDA NOBUHIKO
分类号 H05K3/38;C09J7/02;C09J11/04;C09J11/06;C09J121/00;C09J163/00;H05K1/02;H05K3/28 主分类号 H05K3/38
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