| 摘要 |
<p>A method for forming a duct interconnect generally includes providing a digital model of a first duct structure and a second duct structure, the first duct structure including a first duct section having a passage for conveying a substance and an interconnect component moveably and captively coupled to the duct section. The second duct structure includes a second duct structure and a second interconnect component. The process includes forming, via a direct manufacturing procedure (e.g., stereolithography), a physical model of the first duct and second structures in accordance with the digital models, wherein the interconnect component has a locked and unlocked state, and wherein the unlocked state corresponds to a predetermined compressive force between the first duct structure and a second duct structure.</p> |
