| 摘要 |
<p>A substrate cutting apparatus is described comprising, a feeding robot (310) for feeding a mother substrate (300) which includes a conjoined first substrate and second substrate (300a, 300b), a substrate conveyer (320) for conveying the mother substrate (300) fed from the feeding robot (310), a scriber (330) for forming cracks having a predetermined depth in the first and second substrate (300a 300b) of the mother substrate (300) conveyed by the substrate conveyor (320) along separation lines on the first and second substrate (300a, 300b), a breaker (340) for receiving the mother substrate (300) from the scriber (330), and separating the mother substrate (300) into unit liquid crystal panels, and a panel inverter (350) for inverting the separated liquid crystal panels.</p> |
