| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized and highly integrated semiconductor device which allows easy and reliable packaging test. SOLUTION: A semiconductor device comprises at least a packaging main body 4 having a wiring board 2 with external terminals 6 on a surface, an overlap portion 5 having a wiring board on which an electronic part including at least a semiconductor chip is mounted, and at least a fold portion 3 having the flexible wiring board 2 which electrically and mechanically connects the packaging main body 4 and the overlap portion 5 which are of the same type or different types of material. The overlap portion 5 is folded at the fold portion 3 and laid on the predetermined packaging main body 4. The packaging main body 4, the fold portion 3 and the wiring board 2 of the overlap portion 5 comprise flexible material (resin film) which can be integrated and can be transparent. The packaging main body 4 also has external terminals within its region overlapped with the electronic-part mounting region of the overlap portion 5. The overlap portion 5 is fixed to the packaging main body 4 with fixing means (adhesive). The mounting region of the semiconductor chip (electronic part) is covered with a seal member 7. |
