Clamping device for processing electronic devices

摘要

A clamping device is provided for holding an electronic device, such as a semiconductor carrier in the form of a leadframe, during processing thereof. It includes a main body for covering the electronic device and an opening in the main body for providing access to a part of the electronic device to be worked upon. A support structure is attachable for coupling it to a periphery of the opening whereby the support structure is extended across the opening for supporting the part of the electronic device that is accessible through the opening.