APPARATUS FOR TREATING CHEMICAL TO SEMICONDUCTOR WAFER

摘要

An apparatus for treating chemicals onto a semiconductor wafer is provided to discharge residual chemicals from a back nozzle by connecting a discharging tube to the back nozzle. A chemical treatment process for a wafer is performed by supplying chemicals through a front nozzle(113) and a back nozzle(120) to a front surface and a rear surface of the wafer. A chemical discharging tube(116) is combined with the back nozzle in order to discharge the remaining chemicals of the back nozzle. The back nozzle includes a value for maintaining a normal close state to control a supplying state of the chemicals, and a value for maintaining a normal open state to control a discharging state of the chemicals.