СПОСОБ ПОСАДКИ КРЕМНИЕВОГО КРИСТАЛЛА НА ОСНОВАНИЕКОРПУСА

摘要

FIELD: physics; electronics. ^ SUBSTANCE: invention relates to microelectronics and can be used in making semiconductor devices and integrated circuits. The method of seating a silicon chip onto the base of a housing for a semiconductor device involves successive deposition of metal layers onto the seating surface of the chip and soldering the chip to the base of the housing. Two metals - titanium and germanium are deposited on the seating surface of the chip. The process is carried out in a single fabrication cycle, and the chip is soldered to the base of the housing at temperature ranging from 300 to 320C. ^ EFFECT: more reliable contact between the chip and the base of the housing and stability of the soldering process. ^ 2 ex