| 摘要 |
A wafer detecting apparatus of implant process equipment is provided to prevent the damage of a wafer due to the impact between a wafer chuck assembly and the wafer by detecting a protruded portion of the wafer using detecting sensors and a controller. A wafer detecting apparatus(101) of implant process equipment detects simultaneously a plurality wafers of a wafer cassette. The wafer detecting apparatus includes first detecting sensors, second detecting sensors and a controller. The first detecting sensors(141,142) are installed at front and rear portions of the wafer cassette in order to check a protruded portion of the wafer. The second detecting sensors(145,146) are installed at the front and rear portions of the wafer cassette in order to check doubly the protruded portion of the wafer. The controller(151) are connected with the first and second detecting sensors. The controller is capable of generating an alarm in case of the existence of a protruded wafer.
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