| 发明名称 |
Chip package with multiple chips connected by bumps |
| 摘要 |
A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.
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| 申请公布号 |
US7242099(B2) |
申请公布日期 |
2007.07.10 |
| 申请号 |
US20030695630 |
申请日期 |
2003.10.27 |
| 申请人 |
MEGICA CORPORATION |
发明人 |
LIN SHIH-HSIUNG;LIN MOU-SHIUNG |
| 分类号 |
H01L29/40;H01L21/60;H01L21/68;H01L21/98;H01L23/48;H01L23/485;H01L23/52;H01L25/065;H05K3/24;H05K3/32 |
主分类号 |
H01L29/40 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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