| 摘要 |
An ultrasonic CMP polishing pad analyzer is disclosed. The analyzer provides a manufacturer or other user an ability to inspect a CMP polishing pad without removing the pad from the CMP machine by creating and displaying a topographical image of an in-service polishing pad. The analyzer includes an ultrasonic transducer and an analyzer body mounted to the CMP machine such that the ultrasonic transducer is positioned to receive reflected ultrasonic signals from a surface of the polishing pad.
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