AN IMAGE SENSOR MODULE STRUCTURE AND A METHOD FOR MANUFACTURING THE SAME

摘要

A method for manufacturing an image sensor module structure is provided to reduce manufacturing costs of an image sensor module and a size of a package by modifying the image sensor module structure. A substrate(40) includes an upper surface(52) having first electrodes(56) and a lower surface(54) having second electrodes(58) connected electrically to the first electrodes. A chip is mounted on the upper surface of the substrate and includes a sensor region and a plurality of bonding pads(62) arranged on a lateral surface of the sensor region. A plurality of wires(44) are formed to connect electrically the bonding pads to the first electrodes. An adhesive layer(46) is coated on the upper surface of the substrate. A lens holder(48) includes a sidewall and an internal thread in order to cover the wires by pushing the adhesive layer. A lens barrel(50) includes an external thread coupled with the internal screw.