MULTI-STACKING PACKAGE AND MANUFACTURING METHOD OF THE SAME

摘要

A multi-stack package and a method for manufacturing the same are provided to secure good operational performance by minimizing effectively deterioration, deformation, and damage thereof. A second package(120) is arranged on an upper surface of a first package(110). A first bump(151) is formed on an upper surface of the first package. A second bump(152) is formed on a lower surface of the second package and is pressed onto the first bump. The second bump is positioned on the same axis as the axis of the first bump in order to connect electrically the first and second packages to each other. A third bump(153) is formed on a lower surface of the first package in order to be positioned on a vertical axis.