发明名称 |
Wafer level package fabrication method using laser illumination |
摘要 |
The present invention relates to a WLP fabrication method capable of welding a lid wafer with a device wafer by using laser illumination. The WLP fabrication method can rapidly weld bonding metal strips of device and lid wafers with each other in order to couple the lid wafer with the device wafer while sealing an internal cavity from the outside without giving any thermal effect to a drive unit in the device wafer.
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申请公布号 |
US7241966(B2) |
申请公布日期 |
2007.07.10 |
申请号 |
US20040980304 |
申请日期 |
2004.11.04 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
SUNWOO KOOK HYUN;KWON JONG OH;LEE JOO HO |
分类号 |
B23K26/32;B23K101/40;H01L21/00;H01L21/52 |
主分类号 |
B23K26/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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