| 摘要 |
A method for manufacturing a droplet ejection head includes a step of forming recessed sections for forming nozzles by etching half way through a first face of a silicon substrate, a step of bonding a first support substrate to the first face of the silicon substrate, a step of reducing the thickness of the silicon substrate by processing a second face of the silicon substrate that is opposite to the first face thereof, and making the recessed sections through holes, and a step of removing the first support substrate from the silicon substrate after the reduction of the thickness of the silicon substrate. |
