| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a low-cost infrared detector whose height has been reduced. <P>SOLUTION: The infrared detector A comprises: a printed-wiring board 10, where an infrared light receiving element 20, an IC component 21 in which the signal processing circuit of the infrared light receiving element 20 is integrated, and an externally mounted electronic component 22 are packaged; a metal case 1 for sealing at least the component packaging part of the printed-wiring board 10; and an infrared transmission filter 6 that is mounted to an opening window 5 provided at the part of the metal case 1 that opposes the light reception surface of the infrared light receiving element 20. The IC component 21 is die-bonded to the part of a back board 4 exposed from a through hole 13 formed on the printed-wiring board 10. A bonding pad provided on the surface of the printed-wiring board 10 makes continuity with that of the IC component 21 via a bonding wire made of a metal small-gauge wire. <P>COPYRIGHT: (C)2007,JPO&INPIT |
