| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board whereon wiring patterns with excellent dimensional precision can be formed without causing a step difference to an insulation layer. <P>SOLUTION: In the method of manufacturing the wiring board wherein two metallic base members 10, one-side faces of which are opposed to each other are adhered to each other, a multi-layered wiring board is formed to the other sides of the respective base members 10, then both the base members 10 are separated from each other and thereafter, the respective base members 10 are removed from the multi-layered wiring boards to manufacture the independent wireless boards, when the two base members 10 are adhered, a liquid mold release is coated or printed onto parts of the two base members 10 except circumference ridges of each one side, an adhesive resin sheet 11 is inserted between the two base members 10, and the circumference ridges of the base members 10 to which no mold release is adhered are adhered to and joined with each other. <P>COPYRIGHT: (C)2007,JPO&INPIT |
