| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve a fault during compression bonding of an antenna in a radio chip having a thin film. <P>SOLUTION: In a radio chip made of a thin film, the chip includes a memory area having an organic chemical compound layer especially, and a distance between an end part of the memory area and an end part of a pad is 500 μm or longer. As a result, writing data can be performed without being affected by stress and heat during compression bonding of the antenna. A glass substrate and a silicon wafer are usable for a substrate mounting such radio chip thereon. <P>COPYRIGHT: (C)2007,JPO&INPIT |
