| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste filling method that can use a simple method with a high filling rate to fill a through-hole in an insulating sheet with conductive paste, and a wiring board manufacturing method that efficiently manufactures a wiring board having highly conductive vias using the filling method. SOLUTION: In a method for filling a through-hole 3 formed at an insulating sheet 1 with conductive paste 4, the insulating sheet 1 having the through-hole 3 is curved so that the upper surface side of the sheet 1 is convex, and the through-hole 3 is filled with the conductive paste 4 from the upper surface side. COPYRIGHT: (C)2007,JPO&INPIT |
