| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder paste applicator for stably applying a very small amount of solder paste, using a simple constitution. SOLUTION: The solder paste applicator 1 is used for succeedingly applying the solder paste 5 onto a printed wiring board 2. The solder paste applicator is provided with a solder discharge mechanism 11 and a three-axis movement mechanism 4. The solder discharge mechanism 11 has a nozzle 6 for discharging the solder paste 5. The three-axis movement mechanism 4 three-dimensionally and freely movably holds the solder discharge mechanism 11. A flexure, elastically deformable during contact between the printed wiring board 2 and a nozzle tip 62, is provided between a holder for the solder discharge mechanism 11 in the three-axis movement mechanism 4 and the nozzle tip 62 of the nozzle 6 in the solder discharge mechanism 11. COPYRIGHT: (C)2007,JPO&INPIT |
